• IC Test & Burn-in socket for eMMC semiconductors in BGA packages

    SOCKETS-CONNECTORS

    wide range sockets for eMMC semiconductors in BGA package

  • test sockets for various packages such as BGA PGA QFP QFN SOP SOIC TSOP and others

    SOCKETS-CONNECTORS

    IC Test & Burn-in sockets for BGA PGA QFP QFN SOP SOIC TSOP packages

  • We can help you to design PCB for your new projects or update design of your existing projects

    SOCKETS-CONNECTORS

    PCB design for your projects

What do we have to offer ?

What do we have to offer ?

Quick response time

Our team is ready and will respond on your inquiries on test socket in less than 24 hours, but in most cases within the same work day.

Competitive pricing

We can provide you with very competetive pricing even on the small quantities of test sockets, so don't hesitate and contact us now

Comprehensive selection

We can recommend suitable socket from our comprehensive range of test sockets / burn-in sockets produced by hi-quality manufacturers with operating temperature range as low as -50°C up to max 170°C

Tailor made solutions

Apart standard solution for test sockets we also offer custom designed - tailor made test sockets for testing and programming huge range of semiconductors. Send us device specification and we can pick right solution for you.


What are test & burn-in socket ?

Burn-in is one of testing processes designed to detect failures in semiconductors and reduce potential for defects in the final application. During burn-in, component will undergo extreme operating conditions, including high temperature, voltage and using cycles.

Test & burn-in socket provides semi-permanent connection between device and PCB and exposes a component at a high temperature for a specified time in an attempt to stress all elements of the device at maximum rated operating conditions in order to reveal all stress and time dependent failure modes.

Test & burn-in sockets are typically made with high temperature plastics, conductive metal contacts, and various springs and hardware. We can divide test & burn-in sockets into two main categories: clam-shell and open-top.


Clam-shell socket consist of two parts, a lid and a body. Device under test is placed in the body of socket and when lid is closed, it delivers force to the testing component to actuate the burn-in socket contacts. Clam-shell sockets are usually operated manually and require lower press force to operate.

open-top socket
IC test socket - open top type
clam-shell socket
IC test socket - clam shell type

Open-top burn-in sockets operates in different way. Testing component can be seen from the top (unlike clam-shell type, where testing components is covered by lid during testing), to load socket with component, sockets need to be pressed down to load - and keep pressed down during entire loading process, when released, socket pins will deliver press force to the testing component and actuate burn-in socket contacts. Advantage of open-top burn-in sockets is, it can be operated by robotic handlers, but usually require higher pressing force compare to clam-shell type.

We are cooperating with all major socket manufacturers and custom socket manufacturers - that allows us to cover all requirements from our customers.


Popular IC Test & Burn-in sockets

  • OTS-20-1.27-01

    • supports SOIC packages
    • 1.27mm pitch
    • 20 pins
    • open-top very durable burn-in socket
    very durable burn-in socket with support 10000+ insertions, designed for SOP and SOIC packages with 20pins and package size 5.40mm width and max 13.10mm length.
  • OTS-24-0.65-01

    • supports TSSOP packages
    • 0.65mm pitch
    • 24 pins
    • open-top very durable burn-in socket
    designed for SSOP and TSSOP packages with 24pins and package size 6.40x4.40mm
  • OTQ-144-0.65-02

    • supports QFP packages
    • 0.65mm pitch
    • 144 pins
    • open-top very durable burn-in socket
    OTQ-144-0.65-02 actuation force is 5,0kg.
  • OTS-28-0.65-01

    • supports TSSOP packages
    • 0.65mm pitch
    • 28 pins
    • open-top very durable burn-in socket
    This sockets supports among many others also TI MSP430i20*, TI PGA450TPWRQ1, TI MSP430F122, TI MSP430F123, Nuvoton N79E715A, Nuvoton N76E885A, NXP PCF7945FTT/L1AC1900, NXP PCF7953ATT/M1AC1500, NXP LPC1114FDH28, NXP LPC1112FDH28, NXP P89LPC9*, Renesas IDT5V49EE90*
  • SB0153F-SA

    • supports BGA packages
    • 0.5mm pitch
    • 153 pins
    • open-top very durable burn-in socket
    SB0153F-SA, an open-top eMMC test socket designed for reliable and enduring semiconductor testing.
    This through-hole type socket is crafted for 153 eMMC packages, featuring a durable build that exceeds 10,000 testing cycles. Ideal for repeated use, the open-top design facilitates seamless device insertion and removal during testing processes. Trust in the durability and longevity of SB0153F-SA, ensuring consistent performance for your semiconductor testing needs.
  • SB4153AFM-ZGZB-RA

    • supports BGA packages
    • 0.5mm pitch
    • 153 pins
    • open-top very durable burn-in socket
    This socket is specially designed for standard 11.00x10.00 eMMC 153 ball devices
  • 790-41044-101G

    • supports QFN packages
    • 0.5mm pitch
    • 44 pins
    • open-top very durable burn-in socket
    designed for QFN44 packages size 7.00x7.00 mm with 0.5mm pitch.
    Highly durable socket with 10000 guaranteed cycles.
  • 777E1048H205

    • supports BGA packages
    • 0.8mm pitch
    • 48 pins
    • open-top very durable burn-in socket
    burn-in test socket designed for BGA 48-ball packages size 11.00x9.00mm
    Very durable socket with 10000 guaranteed cycles.
  • 775C4356-XXX

    • supports BGA packages
    • 0.5mm pitch
    • 356 pins
    • open-top very durable burn-in socket
    This socket is designed for 15x15mm 356-ball devices with 0.30mm ball diameter and 0.21mm ball height