IC socket 777E1115H203C
- Suitable Packages: supports BGA115 packages
- Socket Pitch: 0.8mm pitch
- Number Of Pins: 115 pins
- Socket Design: open-top
- Durability: very durable burn-in socket
- Manufacturer: Sensata
- RoHS: RoHS Compliant
- Mounting Type: through hole, solder-mounted on the PCB
- Country Of Origin: South Korea
- Stock Availability: Out of stock, please inquire for availability
- Price: Send inquiry
Description:
777E1115H203C is IC Test & Burn-in socket manufactured by Sensata, dedicated for 115-ball BGA package with 0.8mm pitch.This is suitable solution for autoloading equipment / equipment operated by robotic handlers.
Socket drawing available upon request.
Possible alternatives:
Test sockets with similar properties are listed below (2):
777E1115H102C (Sensata)
775E1115-101 (Sensata)
Please note that the test sockets listed as possible alternatives to the Sensata test socket 777E1115H203C are similar in the way they accept IC packages with the same dimensions. However, they may differ in tolerances, operating methods, mounting to the PCB, PCB footprint, etc. Always refer to the technical datasheet to ensure compatibility with your application