IC socket BGA-225-1.5-01A
- Suitable Packages: supports BGA225 packages
- Socket Pitch: 1.5mm pitch
- Number Of Pins: 225 pins
- Socket Design: clam-shell
- Durability: very durable burn-in socket
- Manufacturer: Enplas
- RoHS: RoHS Compliant
- Mounting Type: through hole, solder-mounted on the PCB
- Country Of Origin: Japan
- Stock Availability: In stock for quick delivery
- Price: Send inquiry
Description:
BGA-225-1.5-01A is IC Test & Burn-in socket manufactured by Enplas, dedicated for 225-ball BGA package with 1.5mm pitch.Socket drawing available upon request.