image of BGA-560(1089)-1.27-03

IC socket BGA-560(1089)-1.27-03

  • Suitable Packages: supports BGA560 packages
  • Socket Pitch: 1.27mm pitch
  • Number Of Pins: 560 pins
  • Socket Design: clam-shell
  • Durability: very durable burn-in socket, at least 10000 guaranteed actuations
  • Manufacturer: Enplas
  • RoHS: RoHS Compliant
  • Mounting Type: through hole, solder-mounted on the PCB
  • Country Of Origin: Japan
  • Stock Availability: Out of stock, please inquire for availability
  • Price: Send inquiry

Description:

BGA-560(1089)-1.27-03 is IC Test & Burn-in socket manufactured by Enplas, dedicated for 560-ball BGA package with 1.27mm pitch. BGA-560(1089)-1.27-03 is depopulated version of BGA-1089-1.27-03

Socket drawing available upon request.

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