IC socket FBGA100-003D3
- Suitable Packages: supports BGA100 packages
- Socket Pitch: 0.8mm pitch
- Number Of Pins: 100 pins
- Socket Design: open-top
- Durability: very durable burn-in socket, at least 10000 guaranteed actuations
- Manufacturer: TI
- RoHS: RoHS Compliant
- Mounting Type: through hole, solder-mounted on the PCB
- Country Of Origin: China
- Stock Availability: Out of stock, please inquire for availability
- Price: Send inquiry
Description:
FBGA100-003D3 is IC Test & Burn-in socket manufactured by TI, dedicated for 100-ball BGA package with 0.8mm pitch.This is suitable solution for autoloading equipment / equipment operated by robotic handlers.
Socket drawing available upon request.
Possible alternatives:
Test sockets with similar properties are listed below (1):
777B1100-101 (Sensata)
Please note that the test sockets listed as possible alternatives to the TI test socket FBGA100-003D3 are similar in the way they accept IC packages with the same dimensions. However, they may differ in tolerances, operating methods, mounting to the PCB, PCB footprint, etc. Always refer to the technical datasheet to ensure compatibility with your application