image of FBGA676-027A

IC socket FBGA676-027A

  • Suitable Packages: supports BGA676 packages
  • Socket Pitch: 1.0mm pitch
  • Number Of Pins: 676 pins
  • Socket Design: open-top
  • Durability: very durable burn-in socket, at least 10000 guaranteed actuations
  • Manufacturer: TI
  • RoHS: RoHS Compliant
  • Mounting Type: through hole, solder-mounted on the PCB
  • Country Of Origin: China
  • Stock Availability: In stock for quick delivery
  • Price: Send inquiry

Description:

FBGA676-027A is IC Test & Burn-in socket manufactured by TI, dedicated for 676-ball BGA package with 1.0mm pitch.
This is suitable solution for autoloading equipment / equipment operated by robotic handlers.
Socket drawing available upon request.

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Possible alternatives:

Test sockets with similar properties are listed below (7):
NP352-676-103 (Yamaichi)
Please note that the test sockets listed as possible alternatives to the TI test socket FBGA676-027A are similar in the way they accept IC packages with the same dimensions. However, they may differ in tolerances, operating methods, mounting to the PCB, PCB footprint, etc. Always refer to the technical datasheet to ensure compatibility with your application